810nm High Power LED 3W 2835 SMD LED

810nm LED Emitter with 2835 SMD LED case;

2835FIRC81L42I1A are 810nm LED with 2835 SMD LED case, which have a little heat sink on the bottom of LED, which will make this SMD LED have a good heating performance. So that we can put the biggest single chip of 810nm inside of it. But this does not mean that we do not need to consider the heat dissipation when designing the circuit of PCB. Because it will make a lots of heat when we install this High Power IR LED in the PCB and use it with high current like 1000mA. Make sure the board have a good heat dissipation performance will make sure this SMD LED have a long lifespan. 

810nm High Power LED 2835 LED Size: 

Electrical Parameters:

*Pulse forward current confition: Duty 1% and Pulse width=10us.

*Soldering confition: Soldering confition must be completed with 3 secongds at 260℃

*Luminous intensity is measured by ZWL600.

*λD is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.

Production of SMD LED 2835 LED:

HANDLING PRECAUTIONS:

Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible Althouth its characteristiec significantly reduces thermal stress, it is more susceptible to damage by extemal mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated Led products. Failure to comply might lead to damage and premature failure of the led

1. Handle the component along the side surfaces by using forceps or appropriate tools.

2, Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.

3, Do not stack together assembled PCBS containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry.

4, 4-A The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks;

    4-B A plible material is suggested for the nozzle tip to avoid acratching or damaging the LED surface during pickup.

    4-C The dimension of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production;

    4-D As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plationg of leadframe. Special care should be taken if an LED with silicone encapsulation is to used near such substances.

5, Please aviod continued exposure to the condensing moisture environment and keep the product away from repid transitions in ambiemt temperature.

6, Product in the original sealed package is recommended to be assembled within 24 hours of opening.