Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.
Packaging: Carton box
Productivity: 1000000 pcs/week
Transportation: Ocean,Land,Air
Place of Origin: China
Supply Ability: 1000000 pcs/week
Certificate: GB/T19001-2008/ISO9001:2008
HS Code: 8541401000
Port: SHENZHEN
Payment Type: T/T,Paypal
Incoterm: FOB,EXW,FCA
Model No.: 1004LGD-12
Brand: Best LED
Supply Type: Original Manufacturer
Reference Materials: Photo
Place Of Origin: China
Species: Led
Package Type: Through Hole
Luminous Intensity: High Directivity
Color: Green
Formation: Gold Thread
Current: 20ma
Voltage: 3.0-3.2v
Certification: Ce
Usage: Other
Application: Electronic Products
Inner Packing: Anti-Static Bag
Polarity: Short Pin Is The Cathode
Type: Super Brightness Led
Wavelength: 520-525nm
Lens Type: Diffused Green
Beam Width: 40 Degree
Brightness: 3000-4000mcd
Selling Units: | Piece/Pieces |
---|---|
Package Type: | Carton box |
Diffused Green Through-hole LED 10mm Mini LED Bulb
1003LGD-20U and 1004GD-12 are both diffused Green Through-Hole LED with 10mm size. Compare with 1003LGD-20U, this 1004GD-12 will got more diffused lens so that from the picture you can not see the LED frame in side. Because of this green diffused lesn, this LED might cannot light up a long distance but it will got soft light and those light will be concentrated in the LED bulb, which can make a super bright green LED bulb with 520nm LED. Green LED can be package with different way, SMD LED or through-hole LED type. After you decide the package way, there will also have kinds of shape and size for you. Just feel free to contact us if any questions or some other required(such as if you need this LED to get the standard of salt spray test).
Size of Green Through-Hole Led
Electrical Parameters:
Parameter | Symbol | Rating | Unit |
Power Dissipation | Pd | 100 | mW |
DC Forward Voltage | IF | 30 | mA |
Operating Temperature | Topr | -25 ~ +80 | ℃ |
Storage Temperature Range | Tstg | -40 ~ +80 | ℃ |
Soldering Temperature | Tsol | Reflowing soldering: 260℃ for 5 seconds Hand soldering: 300℃ for 3 seconds | ℃ |
Electro-Static-Discharge(HBM) | ESD | 1000 | V |
Service life under normal conditions | Time | 80000 | H |
Warranty | Time | 2 | Years |
Antistatic bag | Piece | 250 | Bag |
* Pulse forward current condition: Duty 1% and pulse width=10us.
* Soldering condition: Soldering condition must be completed with 3 secongds at 260℃
Electrucal Optical Characteristics(Tc=25℃)
Parameter | Sysmblo | Min | Typ | max | Unit | Test Conditin |
Reverse Current | IR | -- | -- | 5 | V | VR=5V |
Luminous Intensity | IV | 3000 | 3500 | 4000 | mcd | IF=20mA |
Peak Wavelength | λP | | 519 | | nm | IF=20mA |
Dominant Wavelength | λD | 520 | 530 | nm | IF=20mA | |
Viewing Half Angle | 2θ1/2 | | 40 | | deg | IF=20mA |
Flash Frequency | Fted | - | 1.5 | - | Hz | |
*Luminous Intensity is measured by ZWL600.
*θ1/2 is off-sxis angle at which the luminous intenity is half the axia luminous intensity;
Application of Green 520nm LED:
LED lighting project;
LED DIY project;
Storage Conditions:
1. avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature;
2. LEDs should be stored with temperature ≤30℃ and relative humidity<60%℃;
3. Product in the original sealed package is recommended to be assembled within 72 hours of opening;
4. Product in opened package for more than a week should be baked for 6-8 hours at 85-10℃;
LED MOUNTING METHOD
1, The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement;
Lead-forming may be required to insure the lead pitch matches the hole pitch;
Refer to the figure below for proper lead forming procedures;
Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits;
Noted:
○ Correct mounting method;
× Incorrect mounting method;
2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.
Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads;
Pinching stress on the led leads may damage the internal structures and cause failure;
Noted:
○ Correct mounting method;
× Incorrect mounting method;
3. Use stand-offs(Fig 3)or spacers(Fig 4)to securely position the LED above the PCB;
4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend (Fig. 5. Fig. 6)
5. During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures;
Do not perform lead forming once the component has been mounted onto the PCB;
Lead Forming Procedures
1. Lead Forming Procedures;
2. Do not bend the leads more than twice (Fig. 7);
3. During soldering, component covers and holders should leave clearance to avoid placing damaging stress on the LED during soldering(Fig 8);
4. The tip of the soldering iron should never touch the lens epoxy;
5. Through-hole LEDs are incompatible with reflow soldering;
6. If the LED will undergo multiple soldering passes or face other processes where the part may be subjected to intense heat please check with Best LED for compatibility;
Tel: 86-0755-89752405
Whatsapp: +8615815584344
Email: amywu@byt-light.comAddress: No.3, Lida alley, Qiuwu community, Longgang District, Shenzhen, Guangdong, China. 518116, Shenzhen, Guangdong China
Website: https://www.bestsmd.com
Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.
Fill in more information so that we can get in touch with you faster
Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.