5mm IR LED 970nm 980nm 990nm LED

5mm IR LED Emitter with wavelength 980nm(±10nm)

970nm LED, 980nm LED are all can be packaged with different size. SMD LED type or through-hole LED Lamps type. For this 503FIRC-98L14I100, we produce it with 5mm throh-hole LED IR LED, in this shape, this IR LED can will be able to emits more longer radiation distance. Because the epoxy on the top of LED chip are kind of magnifier, which will increase the light and make it got longer radiation area. On the other hand, we can make it with 2835 SMD LED case or even smaller size. 

If you need some 980nm or 970nm LED for your project, just feel free to contact us and we will make them as your required. 

SMD LED Features:

Dimension: 5mm;

Wavelength: 980nm LED;

Lens type: Clear epoxy;

High reliability and high radiation intersity;

Electrical Parameters:

*Pulse forward current confition: Duty 1% and Pulse width=10us.

*Soldering confition: Soldering confition must be completed with 3 secongds at 260℃

*Luminous intensity is measured by ZWL600.

*λD is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.

Storage Conditions: 

1. avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature;

2. LEDs should be stored with temperature ≤30℃ and relative humidity<60%℃;

3. Product in the original sealed package is recommended to be assembled within 72 hours of opening;

4. Product in opened package for more than a week should be baked for 6-8 hours at 85-10℃;

LED MOUNTING METHOD

1, The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement;

Lead-forming may be required to insure the lead pitch matches the hole pitch;

Refer to the figure below for proper lead forming procedures;

Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits;

Noted:

○ Correct mounting method;

× Incorrect mounting method;

2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.

Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads;

Pinching stress on the led leads may damage the internal structures and cause failure;

Noted:

○ Correct mounting method;

× Incorrect mounting method;

3. Use stand-offs(Fig 3)or spacers(Fig 4)to securely position the LED above the PCB;

4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend (Fig. 5. Fig. 6)

5. During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures;

Do not perform lead forming once the component has been mounted onto the PCB;

Lead Forming Procedures

1. Lead Forming Procedures;

2. Do not bend the leads more than twice (Fig. 7);

3. During soldering, component covers and holders should leave clearance to avoid placing damaging stress on the LED during soldering(Fig 8);

4. The tip of the soldering iron should never touch the lens epoxy;

5. Through-hole LEDs are incompatible with reflow soldering;

6. If the LED will undergo multiple soldering passes or face other processes where the part may be subjected to intense heat please check with Best LED for compatibility;