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Packaging: Carton box
Productivity: 1000000000 pcs/week
Transportation: Ocean,Land,Air
Place of Origin: China
Supply Ability: 7000000000 pcs/week
Certificate: GB/T19001-2008/ISO9001:2008
HS Code: 8541401000
Port: SHENZHEN
Payment Type: T/T,Paypal
Incoterm: FOB,EXW,FCA
Model No.: 5730FRC668P8L14P2
Brand: Best LED
Types Of: Smd Led
Support Dimming: Yes
Lamp Life (hours): 50000
Working Hours (hours): 50000
Chip Material: Ingan
Luminous Color: Red
Power: Other
Place Of Origin: China
Certification: Rohs, Ce
LED Type: SMD LED
Chip Quantity Red SMD LED: 2 Chip
Viewing Angle: 120 degree
Lens Type: Clear Transparent
Wavelength: 660nm LED
Color: Deep red color
Size Of SMD LED: 5.7*3.0mm
Luminous Intensity: 8-10lm
Operation Current: 150mA
Main Application: LED Grow Light; LED Therapy; Medical Applications;
Normally there will just a single LED chip inside the SMD LED package. From the picture as follow, we can see there are two chips inside the 5730 SMD LED package, the part number is 5730FRC668P8L14P2. Which is a 660Nm LED and it's light-emitting diode that emits light with a wavelength of 660 nanometers. This specific wavelength falls within the red spectrum of light. SMD stands for Surface Mount Device, which refers to the packaging technology used for the LED. SMD LED are small and compact, making them suitable for various applications such as lighting, displays, and indicators. People mostly use this 660nm LED for their LED grow light application, which is a type of lighting system specifically designed for indoor gardening and plant cultivation. They provide the necessary light spectrum and intensity required for plants to grow and thrive. The light of 660nm wavelength will help a lot in this case.
5730 Red SMD LED Features:
Dimension: 5.7*3.0mm;
Color: Deep Red LED Light;
Lens type: Transparent epoxy;
High reliability and high radiation intersity;
*This package size are also available in Amber LED, UV LED, IR LED , Yellow LED*
Electrical Parameters:
Parameter | Symbol | Rating | Unit |
Reverse Voltage | VR | 5 | V |
Junction Temperature | Tj | 115 | ℃ |
Operating Temperature | Topr | -40 - +80 | ℃ |
Storage Temperature | Tstg | -40 - +100 | ℃ |
Soldering Temperature | Tsol | 260 | ℃ |
Electro-Stati-Discharge(HBM) | ESD | 2000 | V |
Service lige under normal conditions | Time | 50000 | H |
Warranty | Time | 2 | Years |
Antistatic bag | Piece | 1000 | Back |
*Pulse forward current confition: Duty 1% and Pulse width=10us.
*Soldering confition: Soldering confition must be completed with 3 secongds at 260℃
Parameter | Symbol | Min | Type | Max | Unit | Test Condition |
Forward Voltage | VF | 2.0 | - | 2.6 | V | IF=150mA |
Brightness | IE | 8 | - | 10 | LM | IF=150mA |
Peak Wavelength | λP | 668 | nm | IF=150mA | ||
Half Width | λ△ |
| 50 |
| nm | IF=150mA |
Viewing Half Angle | θ | | 120 |
| deg | IF=150mA |
Reverse Current | IR | | | 5 | uA | VR=5 |
*Luminous intensity is measured by ZWL600.
*λD is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.
Storage Conditions:
1. avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature;
2. LEDs should be stored with temperature ≤30℃ and relative humidity<60%℃;
3. Product in the original sealed package is recommended to be assembled within 72 hours of opening;
4. Product in opened package for more than a week should be baked for 6-8 hours at 85-10℃;
LED MOUNTING METHOD
1, The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement;
Lead-forming may be required to insure the lead pitch matches the hole pitch;
Refer to the figure below for proper lead forming procedures;
Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits;
Noted:
○ Correct mounting method;
× Incorrect mounting method;
2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.
Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads;
Pinching stress on the led leads may damage the internal structures and cause failure;
Noted:
○ Correct mounting method;
× Incorrect mounting method;
3. Use stand-offs(Fig 3)or spacers(Fig 4)to securely position the LED above the PCB;
4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend (Fig. 5. Fig. 6)
5. During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures;
Do not perform lead forming once the component has been mounted onto the PCB;
Lead Forming Procedures
1. Lead Forming Procedures;
2. Do not bend the leads more than twice (Fig. 7);
3. During soldering, component covers and holders should leave clearance to avoid placing damaging stress on the LED during soldering(Fig 8);
4. The tip of the soldering iron should never touch the lens epoxy;
5. Through-hole LEDs are incompatible with reflow soldering;
6. If the LED will undergo multiple soldering passes or face other processes where the part may be subjected to intense heat please check with Best LED for compatibility;
Tel: 86-0755-89752405
Whatsapp: +8615815584344
Email: amywu@byt-light.comAddress: No.3, Lida alley, Qiuwu community, Longgang District, Shenzhen, Guangdong, China. 518116, Shenzhen, Guangdong China
Website: https://www.bestsmd.com
Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.