Far Red LED 1450nm 5mm IR LED

Far Red IR LED with 1450nm LED 

We can produce the same LED chip with different pakcage way, such as SMD LED type or through-hole LED Lamps type. In this product, we produce this 504FIRBT-150L14I100 inside of 5mm Through-hole LED. This is IR LED, but the wavelength is not a common wavelength and its very high, we also name those 1550nm LED,  1300nm LED or 1050nm LED as far red LED. 

Compare with smd led IR LED, such as 2835 SMD LED type. We will get more raditaion distance from this 5mm LED package than 2835 SMD LED type. If you need this 1450nm LED to emits a longer distance then please go with through-hole LED type. But if you need this IR LED to emits a wider area for your project, then please go with SMD LED type. 

Storage Conditions: 

1. avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature;

2. LEDs should be stored with temperature ≤30℃ and relative humidity<60%℃;

3. Product in the original sealed package is recommended to be assembled within 72 hours of opening;

4. Product in opened package for more than a week should be baked for 6-8 hours at 85-10℃;

LED MOUNTING METHOD

1, The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement;

Lead-forming may be required to insure the lead pitch matches the hole pitch;

Refer to the figure below for proper lead forming procedures;

Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits;

Noted:

○ Correct mounting method;

× Incorrect mounting method;

2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.

Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads;

Pinching stress on the led leads may damage the internal structures and cause failure;

Noted:

○ Correct mounting method;

× Incorrect mounting method;

3. Use stand-offs(Fig 3)or spacers(Fig 4)to securely position the LED above the PCB;

4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend (Fig. 5. Fig. 6)

5. During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures;

Do not perform lead forming once the component has been mounted onto the PCB;

Lead Forming Procedures

1. Lead Forming Procedures;

2. Do not bend the leads more than twice (Fig. 7);

3. During soldering, component covers and holders should leave clearance to avoid placing damaging stress on the LED during soldering(Fig 8);

4. The tip of the soldering iron should never touch the lens epoxy;

5. Through-hole LEDs are incompatible with reflow soldering;

6. If the LED will undergo multiple soldering passes or face other processes where the part may be subjected to intense heat please check with Best LED for compatibility;