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Packaging: Carton box
Productivity: 1000000 pcs/week
Transportation: Ocean,Land,Air
Place of Origin: China
Supply Ability: 1000000 pcs/week
Certificate: GB/T19001-2008/ISO9001:2008
HS Code: 8541401000
Port: SHENZHEN
Payment Type: T/T,Paypal
Incoterm: FOB,EXW,FCA
Model No.: 1004LGC-12
Brand: Best LED
Supply Type: Original Manufacturer
Reference Materials: Photo
Place Of Origin: China
Species: Led
Package Type: Through Hole
Current: 20ma
Certification: Ce
Usage: Other
Application: Electronic Products
Luminous Intensity: High Directivity
Color: Green
Formation: Gold Thread
Type: Super Brightness Led
Inner Packing: Anti-Static Bag
Polarity: Short Pin Is The Cathode
Voltage: 3.0-3.2v
Wavelength: 520-525nm
Lens Type: Green Clear
Beam Width: 40 Degree
Brightness: 20000-30000mcd
Selling Units: | Piece/Pieces |
---|---|
Package Type: | Carton box |
10mm Green LED Lamp Light Blub with Clear Lens
As we know, there have kinds of shape and size for through-hole LED Lamps, such as rectangle, round top, flat top ect. And for the size, 3mm, 5mm, 8mm and even 10mm LED size are available. In this 1004LGC-12, we produce it with 10mm green clear epoxy in the outside as case. With this green clear case, this 100mm Green Through-hole LED are able to emits the brightness and color as what it should be. In addition, we can also know what is its color when this mini LED bulb are not being light up.
This 10mm LED normall will be used to output as much LED light bulb as possible. In order to make sure it can get a perfect performance, we produce it with big size famous brand new LED chip inside, which means it can handle more operation current and got more stable performance even at the high working current. The brightness can reach 20000-30000mcd when you pass the current to it. If you need some Super Bright LED Lamps for your project and need this with 10mm size, this one won't let you disappointment~
Size of Green Through-Hole LED
Electrical Parameters:
Parameter | Symbol | Rating | Unit |
Power Dissipation | Pd | 100 | mW |
DC Forward Voltage | IF | 30 | mA |
Operating Temperature | Topr | -25 ~ +80 | ℃ |
Storage Temperature Range | Tstg | -40 ~ +80 | ℃ |
Soldering Temperature | Tsol | Reflowing soldering: 260℃ for 5 seconds Hand soldering: 300℃ for 3 seconds | ℃ |
Electro-Static-Discharge(HBM) | ESD | 1000 | V |
Service life under normal conditions | Time | 80000 | H |
Warranty | Time | 2 | Years |
Antistatic bag | Piece | 250 | Bag |
* Pulse forward current condition: Duty 1% and pulse width=10us.
* Soldering condition: Soldering condition must be completed with 3 secongds at 260℃
Electrucal Optical Characteristics(Tc=25℃)
Parameter | Sysmblo | Min | Typ | max | Unit | Test Conditin |
Reverse Current | IR | -- | -- | 5 | V | VR=5V |
Luminous Intensity | IV | 20000 | 25000 | 30000 | mcd | IF=20mA |
Peak Wavelength | λP | | 519 | | nm | IF=20mA |
Dominant Wavelength | λD | 520 | 530 | nm | IF=20mA | |
Viewing Half Angle | 2θ1/2 | | 40 | | deg | IF=20mA |
Flash Frequency | Fted | - | 1.5 | - | Hz | |
*Luminous Intensity is measured by ZWL600.
*θ1/2 is off-sxis angle at which the luminous intenity is half the axia luminous intensity;
Application of Green 520nm LED:
LED lighting project;
LED DIY project;
Storage Conditions:
1. avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature;
2. LEDs should be stored with temperature ≤30℃ and relative humidity<60%℃;
3. Product in the original sealed package is recommended to be assembled within 72 hours of opening;
4. Product in opened package for more than a week should be baked for 6-8 hours at 85-10℃;
LED MOUNTING METHOD
1, The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement;
Lead-forming may be required to insure the lead pitch matches the hole pitch;
Refer to the figure below for proper lead forming procedures;
Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits;
Noted:
○ Correct mounting method;
× Incorrect mounting method;
2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.
Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads;
Pinching stress on the led leads may damage the internal structures and cause failure;
Noted:
○ Correct mounting method;
× Incorrect mounting method;
3. Use stand-offs(Fig 3)or spacers(Fig 4)to securely position the LED above the PCB;
4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend (Fig. 5. Fig. 6)
5. During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures;
Do not perform lead forming once the component has been mounted onto the PCB;
Lead Forming Procedures
1. Lead Forming Procedures;
2. Do not bend the leads more than twice (Fig. 7);
3. During soldering, component covers and holders should leave clearance to avoid placing damaging stress on the LED during soldering(Fig 8);
4. The tip of the soldering iron should never touch the lens epoxy;
5. Through-hole LEDs are incompatible with reflow soldering;
6. If the LED will undergo multiple soldering passes or face other processes where the part may be subjected to intense heat please check with Best LED for compatibility;
Tel: 86-0755-89752405
Whatsapp: +8615815584344
Email: amywu@byt-light.comAddress: No.3, Lida alley, Qiuwu community, Longgang District, Shenzhen, Guangdong, China. 518116, Shenzhen, Guangdong China
Website: https://www.bestsmd.com
Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.